Non-contact thickness measurement in hot melt calender lines (thickness 30µm to 6mm)

The FTS 8101.EC O-frame is based on the combisensor principle equipped with non-contact capacitive sensors. The distance between sensor and film is measured with the capacitive sensor. The eddy-current sensors ensures the thickness signal by a reference measurement to a second target. The system can be integrated in the flat layer section.

Features:

  • 100% non-contact measurement principle
  • Resolution <0.1µm
  • Adaptable traversing speed

The BTS 8101.EO O-frame is based on the combisensor principle. The system is equipped with a non-contact capacitive sensors and a Thrubeam sensor which are integrated in a traversing frame.

The eddy current sensor measures the reference distance to the measurement roll‘s metal surface. The distance from the film surface is measured by the Thrubeam sensor. Together with the reference signal the film thickness is calculated. This combisensor principle allows extreme precise measurements.

Features:

  • Gap 22 mm
  • Accuracy 3µm
  • Material independent measurements

The FTS 8102.EC C-frame is based on the combisensor principle equipped with non-contact capacitive sensors. The distance between sensor and film is measured with the capacitive sensor. The eddy-current sensors ensures the thickness signal by a reference measurement to a second target. The system is designed as a C-frame and can be used as a traversing unit by using the linear axis.

Features:

  • 100% non-contact measurement principle
  • Resolution <0.1µm
  • Adaptable traversing speed
Contact
MICRO-EPSILON India Private Limited

+91 20 267 410 09

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Micro-Epsilon Messtechnik
Königbacher Str. 15
94496 Ortenburg
info@micro-epsilon.de
+49 8542 / 168 - 0
+49 8542 / 168 - 90